Design and Development of Nanoimprint Models and Technology for 3D Devices

Abstract

Reversal nanoimprint lithography is an emerging technology for realizing 3D nanostructures. Compared to conventional nanoimprint lithography, resist is coated on the stamp rather than the substrate. One of the key points for this technology is to control the surface energy of the stamp and substrate to allow patterns to be transferred from the stamp to the substrate. In this study, we use silane and O2 plasma to control the surface energy. For the silane treatment, the surfaces are coated with a combination of hydrophobic and hydrophilic silane, trichloro (1h, 1h, 2h, 2h-perfluorooctyl) silane (FOTS) and 2-[methoxy(polyethyleneoxy)6-9propyl]trimethoxysilane (MPEOPS), which modify the surfaces to a range of different surface free energies. Effect of O2 plasma treatment on Si, glass, and poly(dimethylsiloxane) (PDMS) to raise the surface energy, and surface stability under different treatments are also studied. As a result, surface energy on Si is successfully controlled within the range of 13-65 mJ/m2 under different silane combination. The transfer of patterns from the stamp to substrate is demonstrated under controlled surface energy on the stamp and substrate.